Director, Chiplet & FCBGA Packaging Strategy

A leading semiconductor company in Tempe, AZ is seeking a Business Unit Product Manager to drive program management and manage key customer accounts in Advanced FCBGA Packaging. This role involves working with customer teams on product assembly, reliability, and manufacturing processes. Candidates should have a Bachelor's degree in Engineering and over 10 years of semiconductor packaging experience. This position offers a hybrid work schedule and requires strong communication and project management skills. #J-18808-Ljbffr