Director, Chiplet Packaging & FCBGA Integration

A semiconductor technology company is looking for a Director, Chiplets and FCBGA in Tempe, AZ. This role involves program management for advanced chiplet-based IC packages and will interface with Tier 1 customers and R&D teams. The ideal candidate has a Bachelor's degree in Engineering and over 10 years of relevant experience in semiconductor package development. This position offers a hybrid work model, requiring some travel. #J-18808-Ljbffr