Director, Chiplet & FCBGA Packaging BU - Growth Leader

A leading semiconductor company in Tempe is seeking an experienced Business Unit Product Manager to oversee program management and key customer accounts in FCBGA Packaging. This role entails collaborating with engineers, conducting risk assessments, and driving internal process developments. Candidates must have at least 10 years of industry experience, a Bachelor’s degree in Engineering, and strong communication skills. The position offers a hybrid schedule and is focused on fostering customer relationships to grow market share. #J-18808-Ljbffr