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Packaging Equipment Innovator for Module Solutions

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading semiconductor company seeks a Packaging Module Equipment Development Engineer in Phoenix, Arizona. The role involves developing innovative assembly processes and equipment to enhance manufacturing efficiency in packaging technologies. Candidates must possess a relevant engineering degree and extensive experience in equipment support. This position requires on-site presence and offers a competitive salary package including bonuses and benefits. #J-18808-Ljbffr