Senior Semiconductor Packaging Mechanical Engineer

A leading semiconductor company is looking for a Semiconductor Packaging Mechanical Engineer in Phoenix, Arizona. This full-time role involves developing multiphysics thermal-mechanical simulations for advanced semiconductor packaging. Candidates must have a PhD in a relevant field and significant experience in thermal-mechanical work. The position requires collaboration across teams and regular on-site presence. The estimated annual salary ranges from $122,440 to $232,190, reflecting experience and location. #J-18808-Ljbffr