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Packaging Equipment Innovator for Module Solutions

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading semiconductor company in Phoenix seeks a Packaging Module Equipment Development Engineer to develop efficient assembly processes and optimize manufacturing technologies. The ideal candidate will have advanced degrees in engineering, physics, or chemistry and a strong background in equipment support. Responsibilities include innovative problem-solving and setting reliability requirements. The position demands a hands-on approach to enhance equipment and processes within competitive compensation and a committed work environment. #J-18808-Ljbffr