Director of Advanced Packaging & Heterogeneous Integration

A global leader in materials engineering solutions is seeking a Director of Heterogeneous Integration/Advanced Packaging in Albany, NY. This role involves developing new semiconductor packaging modules and requires a minimum of 5 years of experience in advanced packaging, particularly with logic, DRAM, or NAND. The ideal candidate will possess strong problem-solving skills and the ability to drive new materials and processes. The position offers a supportive culture and competitive compensation in a dynamic environment. #J-18808-Ljbffr