Director of Advanced Packaging & Heterogeneous Integration

A leading global materials engineering company seeks a professional to join their Advanced Semiconductor Packaging team in Santa Clara, CA. The ideal candidate will have at least 5 years of experience in advanced packaging, particularly with logic, DRAM, or NAND, and hold a relevant degree. Responsibilities include developing new modules and driving material innovations. Candidates must possess strong communication skills and a proven ability to solve complex engineering challenges. Competitive compensation and comprehensive benefits are offered. #J-18808-Ljbffr