Senior Mechanical Engineer: Thermo-Mechanical Packaging

A leading AI infrastructure company based in Silicon Valley is seeking a Senior Mechanical Engineer to develop predictive models and lead mechanical design for advanced semiconductor packaging. You will work with cutting-edge technology aimed at enhancing AI data center performance. The ideal candidate has a Master’s degree, over 10 years of experience, and expertise in multiphysics modeling. The role involves high-level decision-making and contributions to groundbreaking engineering solutions in a world-class team environment. #J-18808-Ljbffr