Semiconductor Packaging Intern: Digital Twin & Simulation

A leading semiconductor company in Scottsdale, AZ, is offering a Summer 2026 internship as a Packaging Modeling and Simulation Intern. The role involves real-world projects focused on innovation in the semiconductor industry, along with responsibilities in simulation and support for product design. Ideal candidates will be enrolled in a relevant degree program and possess skills in thermo-mechanical modeling and CAD tools. This internship provides competitive compensation, flexible hours, and opportunities for professional development. #J-18808-Ljbffr