Semiconductor Packaging Intern: Digital Twin & Simulation

A semiconductor technology company in Scottsdale, AZ is seeking a Summer 2026 Intern for semiconductor packaging modeling and simulation. The ideal candidate will engage in real-world projects involving design optimization, probability analysis, and new product development. Candidates must be enrolled in a relevant degree program, and skills in CAD and modeling are essential. This internship offers opportunities for growth in a collaborative environment with competitive benefits. #J-18808-Ljbffr