Semiconductor Packaging Intern: Digital Twin & Simulation

A semiconductor technology company is offering an internship for Summer 2026 in packaging modeling and simulation. Interns will gain hands-on experience with design optimization and contribute to projects in the semiconductor industry. Candidates must be currently enrolled, preferably pursuing a degree in Physics, Electrical Engineering, or Mechanical Engineering. This role offers competitive compensation, flexible hours, and opportunities for professional development. #J-18808-Ljbffr