Senior RFIC Packaging Designer — 50GHz & GaN Focus

A technology company in Atlanta is seeking an IC Packaging Designer to develop advanced semiconductor packaging solutions for RF integrated circuits. In this role, you will focus on designing packages optimized for high-frequency performance and collaborate with engineering teams to ensure effective integration of RF devices. Candidates should have a degree in Electrical Engineering and experience designing RFIC semiconductor packages up to 50GHz. The position offers a competitive salary and comprehensive benefits. #J-18808-Ljbffr