Sr Director Advanced Packaging
GLOBALFOUNDRIES, Richardson, TX, United States
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
www.gf.com .
Summary of Role: We are seeking an IT leader with extensive experience in end-to-end semiconductor manufacturing processes to lead GFIT in enabling business transformation for Advanced Packaging operations in the US and Singapore. The ideal candidate brings 20+ years of industry experience, with a proven track record of aligning manufacturing operations with enterprise IT by converting complex process requirements into scalable, high-impact digital solutions.
This role sits at the intersection of manufacturing excellence and digital transformation, ensuring Advanced Packaging capabilities are enabled through robust, scalable, and secure IT systems that drive factory performance, yield, and customer quality—across two strategic regions. Exposure to Advanced Packaging processes and operations is highly advantageous.
Essential Responsibilities: Leadership & Strategy
Own the IT vision for Advanced Packaging across US and Singapore; translate business outcomes into a multi-year IT strategy and executable roadmap.
Set technical direction for manufacturing and enterprise IT architecture aligned to corporate standards, operational excellence, and sustainability goals.
Champion transformation—instill a culture of continuous improvement, system reliability by design, and data-driven decision making.
Executive communication—provide clear, concise updates to senior stakeholders on program status, risk posture, resource needs, and value realization.
Collaboration & Stakeholder Management
Partner with Operations (Manufacturing, Process Engineering, Planning, Quality, Industrial Engineering) to define requirements and success metrics.
Engage with Enterprise and Manufacturing IT (Architecture, Solution build, Infra/Cloud, Cybersecurity, Data/Analytics, ERP) to ensure seamless integration and governance compliance.
Vendor & partner management—drive accountability with solution providers, system integrators, and equipment OEMs; negotiate SLAs and deliverables.
Cross-site collaboration—standardize best practices between US and Singapore sites; facilitate communities of practice across plants and functions.
Change management—lead stakeholder alignment, readiness, and adoption; ensure training, SOP updates, and operator buy-in for every release.
Architecture & Solution Design
Work with Enterprise architecture team to define the reference architecture for Advanced Packaging IT, including MES, EBR, equipment integration, IoT/IIoT, data platforms, ERP, APS, and QMS.
Ensure modular, scalable designs that support future nodes, multi-fab operations, and evolving technology stacks (on-prem, hybrid cloud).
Data architecture—establish canonical data models, master data governance, and lineage for traceability, genealogy, and compliance.
Implementation & Program Delivery
Own end-to-end delivery—requirements, design, build/config, integration, validation, rollout, hypercare, and continuous improvement working with project managers and solution delivery teams.
Equipment integration—lead connectivity with heterogeneous tools (e.g., die attach, bump, WLP, fan-out, 2.5D/3D packaging) via SECS/GEM, OPC-UA, or APIs.
Validate manufacturing system - design and enforce testing protocols (IQ/OQ/PQ), data accuracy, and system reliability in production environments.
Drive agile-at-scale—use hybrid agile/waterfall where appropriate for regulated manufacturing contexts; enforce backlog hygiene and sprint discipline.
Advanced Packaging Domain Enablement
Process-aware solutions for fan-out, RDL, TSV, bumping, flip-chip, interposers, die stacking; align IT workflows to sub-process specifics.
Complex BOM/MBOM management—support multi-die assemblies, substrate configurations, and serialization at package level.
Material movement & logistics—design systems for precise lot/container management, cleanroom handling, and traceability across sites.
Governance, Security & Risk
Cybersecurity by design—coordinate with InfoSec on identity, access, segmentation, and secure integration to shop-floor equipment.
Compliance & audit readiness—ensure systems meet corporate policies, customer requirements, data privacy, and export control constraints.
Operational resilience—define DR/BCP, backup strategies, hot/cold failover for critical manufacturing systems.
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications
Education:
Bachelor's or master's degree in a related field.
Experience:
20+ years in semiconductor manufacturing IT, with at least 10+ years in leadership roles across multi-site or global operations.
Deep experience with MES, equipment integration (SECS/GEM), Scheduling/ Dispatching, Advanced Process control and IIoT.
Strong grasp of Advanced Packaging processes and factory operations (preferred).
Proven ability to map manufacturing flows to IT systems; hands‑on experience in complex integrations with ERP (SAP/Oracle), APS, QMS, PLM, and Data/Analytics platforms.
Demonstrated success in program management, stakeholder alignment, and change adoption in high-volume manufacturing environments.
Understanding of industrial cybersecurity, data governance, and regulatory compliance.
Excellent communication, negotiation, and leadership skills; comfortable presenting to executives and coaching technical teams.
Travel:
Periodic travel to Singapore would be required (10-20%).
Soft Skills:
Excellent communication and interpersonal skills. Strong problem‑solving abilities and attention to detail. Ability to work effectively in a fast‑paced, dynamic environment.
Expected Salary Range $193,000.00 - $324,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at
usaccommodations@gf.com
and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case‑by‑case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre‑employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.
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www.gf.com .
Summary of Role: We are seeking an IT leader with extensive experience in end-to-end semiconductor manufacturing processes to lead GFIT in enabling business transformation for Advanced Packaging operations in the US and Singapore. The ideal candidate brings 20+ years of industry experience, with a proven track record of aligning manufacturing operations with enterprise IT by converting complex process requirements into scalable, high-impact digital solutions.
This role sits at the intersection of manufacturing excellence and digital transformation, ensuring Advanced Packaging capabilities are enabled through robust, scalable, and secure IT systems that drive factory performance, yield, and customer quality—across two strategic regions. Exposure to Advanced Packaging processes and operations is highly advantageous.
Essential Responsibilities: Leadership & Strategy
Own the IT vision for Advanced Packaging across US and Singapore; translate business outcomes into a multi-year IT strategy and executable roadmap.
Set technical direction for manufacturing and enterprise IT architecture aligned to corporate standards, operational excellence, and sustainability goals.
Champion transformation—instill a culture of continuous improvement, system reliability by design, and data-driven decision making.
Executive communication—provide clear, concise updates to senior stakeholders on program status, risk posture, resource needs, and value realization.
Collaboration & Stakeholder Management
Partner with Operations (Manufacturing, Process Engineering, Planning, Quality, Industrial Engineering) to define requirements and success metrics.
Engage with Enterprise and Manufacturing IT (Architecture, Solution build, Infra/Cloud, Cybersecurity, Data/Analytics, ERP) to ensure seamless integration and governance compliance.
Vendor & partner management—drive accountability with solution providers, system integrators, and equipment OEMs; negotiate SLAs and deliverables.
Cross-site collaboration—standardize best practices between US and Singapore sites; facilitate communities of practice across plants and functions.
Change management—lead stakeholder alignment, readiness, and adoption; ensure training, SOP updates, and operator buy-in for every release.
Architecture & Solution Design
Work with Enterprise architecture team to define the reference architecture for Advanced Packaging IT, including MES, EBR, equipment integration, IoT/IIoT, data platforms, ERP, APS, and QMS.
Ensure modular, scalable designs that support future nodes, multi-fab operations, and evolving technology stacks (on-prem, hybrid cloud).
Data architecture—establish canonical data models, master data governance, and lineage for traceability, genealogy, and compliance.
Implementation & Program Delivery
Own end-to-end delivery—requirements, design, build/config, integration, validation, rollout, hypercare, and continuous improvement working with project managers and solution delivery teams.
Equipment integration—lead connectivity with heterogeneous tools (e.g., die attach, bump, WLP, fan-out, 2.5D/3D packaging) via SECS/GEM, OPC-UA, or APIs.
Validate manufacturing system - design and enforce testing protocols (IQ/OQ/PQ), data accuracy, and system reliability in production environments.
Drive agile-at-scale—use hybrid agile/waterfall where appropriate for regulated manufacturing contexts; enforce backlog hygiene and sprint discipline.
Advanced Packaging Domain Enablement
Process-aware solutions for fan-out, RDL, TSV, bumping, flip-chip, interposers, die stacking; align IT workflows to sub-process specifics.
Complex BOM/MBOM management—support multi-die assemblies, substrate configurations, and serialization at package level.
Material movement & logistics—design systems for precise lot/container management, cleanroom handling, and traceability across sites.
Governance, Security & Risk
Cybersecurity by design—coordinate with InfoSec on identity, access, segmentation, and secure integration to shop-floor equipment.
Compliance & audit readiness—ensure systems meet corporate policies, customer requirements, data privacy, and export control constraints.
Operational resilience—define DR/BCP, backup strategies, hot/cold failover for critical manufacturing systems.
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications
Education:
Bachelor's or master's degree in a related field.
Experience:
20+ years in semiconductor manufacturing IT, with at least 10+ years in leadership roles across multi-site or global operations.
Deep experience with MES, equipment integration (SECS/GEM), Scheduling/ Dispatching, Advanced Process control and IIoT.
Strong grasp of Advanced Packaging processes and factory operations (preferred).
Proven ability to map manufacturing flows to IT systems; hands‑on experience in complex integrations with ERP (SAP/Oracle), APS, QMS, PLM, and Data/Analytics platforms.
Demonstrated success in program management, stakeholder alignment, and change adoption in high-volume manufacturing environments.
Understanding of industrial cybersecurity, data governance, and regulatory compliance.
Excellent communication, negotiation, and leadership skills; comfortable presenting to executives and coaching technical teams.
Travel:
Periodic travel to Singapore would be required (10-20%).
Soft Skills:
Excellent communication and interpersonal skills. Strong problem‑solving abilities and attention to detail. Ability to work effectively in a fast‑paced, dynamic environment.
Expected Salary Range $193,000.00 - $324,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at
usaccommodations@gf.com
and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case‑by‑case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre‑employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.
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