Senior Director, Advanced Packaging IT Transformation

A leading semiconductor company is seeking an experienced IT leader to manage Advanced Packaging operations. This role requires over 20 years of experience in semiconductor manufacturing IT, with strong capabilities in leadership, project management, and communication. Successful candidates will be responsible for aligning manufacturing processes with IT systems, ensuring effective integration across sites in the US and Singapore. The position requires excellent problem-solving skills and a proven track record in managing complex projects in dynamic environments. The expected salary range is between $193,000 and $324,000. #J-18808-Ljbffr