Xpedition PCB Designer

PCB Design: experience in various software tools including Siemens Mentor Graphics VX. EDM Designed digital high-speed, mixed RF/analog, microwave, and micro-power supplies, specializing in complex multi-layer high speed 1 TB PCB’s with HDI, fine pitch BGA’s and DDR4 with speeds up to 100 Gig Ethernet. Valor NPI Digital High Speed, Mixed RF/Analog and Microwave, Power Supply and Micro-Power PWA Layouts Multi-layer Flex & Rigid-flex circuits Complex Multi-layer PWB’s utilizing micro-strip, strip-line and tuned differential routing. Low noise RF/analog circuitry. RF routing and grounding techniques to achieve high isolation performance, HDI Digital designs with high pin count and fine pitch BGA’s .4mm, RF transmission lines, micro-strip and strip-line impedance, diff pair routing, matched lengths, lead length matching, delay control lengths. Experience with JTAG, DSP, DDR3 & 4, LVDS, Rocket IO, SerDes and 100 Gig Ethernet. Defined blind & buried micro-visas for Class 3 PCBs. RF layout development and wire bonding with partitioning of circuits utilizing shield walls, specific mounting, and grounding requirements. All design criteria defined by IPC, HDI, EMI shielding, engineering specifications and customer requirements. Familiar with all types of PCB materials, laminates, fab, and assembly processes. Work closely with ME’s and EE’s and fab vendors to define board profiles, technology and board stack-ups.Complex designs incorporating stringent mechanical definitions, geometric dimensioning and tolerancing, controlled impedance and complex component mounting utilizing IDF/DXF and Step 3D files.

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