Expert PCB Designer
Point Solutions Group, Carlsbad, CA, United States
Position Overview
We are seeking an
Expert PCB Designer
to support the development of advanced, mission‑critical electronic systems in a secure environment. This role requires deep expertise in
high-speed digital, RF, and analog PCB design , with a focus on complex, multi‑layer boards used in high-performance applications.
The ideal candidate will bring extensive experience designing cutting‑edge PCB layouts, including
HDI, fine‑pitch BGAs, and high‑speed interfaces up to 100 Gigabit Ethernet , while collaborating closely with cross‑functional engineering teams.
Key Responsibilities
Design and develop
complex multi‑layer PCB layouts
for high‑speed digital, RF, analog, microwave, and power applications
Create
high-density interconnect (HDI)
designs, including fine‑pitch BGA (.4mm) components and high pin‑count devices
Implement
controlled impedance routing , including microstrip, stripline, and differential pair routing with matched lengths and delay control
Develop layouts for
DDR3/DDR4, LVDS, SerDes, Rocket I/O, JTAG, DSP , and high-speed interfaces up to
100 Gigabit Ethernet
Perform
RF layout design , including transmission lines, grounding, shielding, and isolation techniques to ensure optimal performance
Design
flex and rigid‑flex circuits
with complex mechanical constraints
Define and implement
blind and buried microvias
for Class 3 PCB standards
Collaborate with
Electrical Engineers (EE), Mechanical Engineers (ME), and fabrication vendors
to define:
Board stack‑ups
Materials and laminates
Fabrication and assembly processes
Integrate mechanical constraints using
IDF, DXF, and STEP 3D files , including geometric dimensioning and tolerancing (GD&T)
Apply
EMI/EMC mitigation techniques
and ensure compliance with IPC standards
Support
DFM (Design for Manufacturability) and DFA (Design for Assembly)
processes
Utilize tools such as
Siemens / Mentor Graphics Xpedition (VX), EDM, and Valor NPI
for design and validation
Mentor junior designers and provide technical leadership as needed
Required Qualifications
Active
Secret Security Clearance
(required to work in SCIF)
10+ years of experience in
PCB design , with a focus on high-speed and RF systems
Expertise in
Mentor Graphics Xpedition (VX) / Siemens PCB tools
and EDM
Strong experience with:
High-speed digital and mixed-signal PCB design
RF and microwave layout techniques
Controlled impedance and signal integrity principles
Proven experience designing
complex, multi-layer PCBs (including 1TB-class designs)
Hands‑on experience with:
HDI design and microvias
Fine-pitch BGAs (.4mm)
DDR3/DDR4 memory layouts
High-speed protocols (LVDS, SerDes, 100GbE)
Deep understanding of
PCB materials, fabrication, and assembly processes
Familiarity with
IPC standards (Class 3 preferred)
Preferred Qualifications
Experience with
RF wire bonding and circuit partitioning using shield walls
Strong background in
low-noise RF/analog design techniques
Experience working in
defense, aerospace, or classified environments
Prior experience mentoring or leading PCB design teams
Work Environment
Onsite work required in a
Secure Compartmented Information Facility (SCIF)
Collaboration with multidisciplinary engineering teams in a fast‑paced, high-security setting
Why Join
Opportunity to work on
cutting-edge, high-performance electronics
Competitive hourly compensation
Collaborative, engineering‑driven environment with impactful, mission‑critical work
#J-18808-Ljbffr
Expert PCB Designer
to support the development of advanced, mission‑critical electronic systems in a secure environment. This role requires deep expertise in
high-speed digital, RF, and analog PCB design , with a focus on complex, multi‑layer boards used in high-performance applications.
The ideal candidate will bring extensive experience designing cutting‑edge PCB layouts, including
HDI, fine‑pitch BGAs, and high‑speed interfaces up to 100 Gigabit Ethernet , while collaborating closely with cross‑functional engineering teams.
Key Responsibilities
Design and develop
complex multi‑layer PCB layouts
for high‑speed digital, RF, analog, microwave, and power applications
Create
high-density interconnect (HDI)
designs, including fine‑pitch BGA (.4mm) components and high pin‑count devices
Implement
controlled impedance routing , including microstrip, stripline, and differential pair routing with matched lengths and delay control
Develop layouts for
DDR3/DDR4, LVDS, SerDes, Rocket I/O, JTAG, DSP , and high-speed interfaces up to
100 Gigabit Ethernet
Perform
RF layout design , including transmission lines, grounding, shielding, and isolation techniques to ensure optimal performance
Design
flex and rigid‑flex circuits
with complex mechanical constraints
Define and implement
blind and buried microvias
for Class 3 PCB standards
Collaborate with
Electrical Engineers (EE), Mechanical Engineers (ME), and fabrication vendors
to define:
Board stack‑ups
Materials and laminates
Fabrication and assembly processes
Integrate mechanical constraints using
IDF, DXF, and STEP 3D files , including geometric dimensioning and tolerancing (GD&T)
Apply
EMI/EMC mitigation techniques
and ensure compliance with IPC standards
Support
DFM (Design for Manufacturability) and DFA (Design for Assembly)
processes
Utilize tools such as
Siemens / Mentor Graphics Xpedition (VX), EDM, and Valor NPI
for design and validation
Mentor junior designers and provide technical leadership as needed
Required Qualifications
Active
Secret Security Clearance
(required to work in SCIF)
10+ years of experience in
PCB design , with a focus on high-speed and RF systems
Expertise in
Mentor Graphics Xpedition (VX) / Siemens PCB tools
and EDM
Strong experience with:
High-speed digital and mixed-signal PCB design
RF and microwave layout techniques
Controlled impedance and signal integrity principles
Proven experience designing
complex, multi-layer PCBs (including 1TB-class designs)
Hands‑on experience with:
HDI design and microvias
Fine-pitch BGAs (.4mm)
DDR3/DDR4 memory layouts
High-speed protocols (LVDS, SerDes, 100GbE)
Deep understanding of
PCB materials, fabrication, and assembly processes
Familiarity with
IPC standards (Class 3 preferred)
Preferred Qualifications
Experience with
RF wire bonding and circuit partitioning using shield walls
Strong background in
low-noise RF/analog design techniques
Experience working in
defense, aerospace, or classified environments
Prior experience mentoring or leading PCB design teams
Work Environment
Onsite work required in a
Secure Compartmented Information Facility (SCIF)
Collaboration with multidisciplinary engineering teams in a fast‑paced, high-security setting
Why Join
Opportunity to work on
cutting-edge, high-performance electronics
Competitive hourly compensation
Collaborative, engineering‑driven environment with impactful, mission‑critical work
#J-18808-Ljbffr