
Package Reliability Engineer (Semiconductors)
Micron Technology, Inc, Boise, ID, United States
A global leader in memory solutions is seeking a Package Reliability Engineer in Boise, ID. In this role, you will coordinate package qualification for new products, develop test plans to evaluate risks, and assist customers on quality matters. Candidates should hold a BS degree in Engineering and possess strong analytical skills. Experience in micro electronics packaging or quality reliability engineering is preferred. This position offers opportunities to influence product quality and contribute to leading-edge technologies.
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