Senior Packaging Engineer (Microelectronics)
Kforce Inc, Tempe, AZ, United States
Responsibilities
Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next‑generation packaging solutions for advanced RF communications products supporting cutting‑edge space systems. In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System‑in‑Package (SiP) designs to complex modules and sub‑assemblies.
Developing advanced packaging architectures for RF communication products
Defining package structures and materials to meet reliability, performance, manufacturability, and cost requirements
Designing and developing semiconductor packages
Driving the full package development lifecycle – package definition, stack‑up, substrate layout, bond diagrams, drawings, predictive modeling, testing, and final release
Utilizing thermal, mechanical, and electrical modeling to ensure early design success
Leading technical engagement with external packaging vendors and manufacturing partners
Supporting technology roadmaps and long‑term packaging innovation initiatives
Requirements
Bachelor's degree in Electrical Engineering or related discipline
Eight or more years of related semiconductor packaging engineering experience
Strong knowledge of microelectronic package structure, mechanical, electrical and thermal performance
Expertise in Outsourced Semiconductor Assembly and Test (OSAT)
Knowledge of complex RF designs
Strong communication and collaboration skills
Compensation and Benefits The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law. This job is not eligible for bonuses, incentives or commissions.
EEO Statement Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
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Developing advanced packaging architectures for RF communication products
Defining package structures and materials to meet reliability, performance, manufacturability, and cost requirements
Designing and developing semiconductor packages
Driving the full package development lifecycle – package definition, stack‑up, substrate layout, bond diagrams, drawings, predictive modeling, testing, and final release
Utilizing thermal, mechanical, and electrical modeling to ensure early design success
Leading technical engagement with external packaging vendors and manufacturing partners
Supporting technology roadmaps and long‑term packaging innovation initiatives
Requirements
Bachelor's degree in Electrical Engineering or related discipline
Eight or more years of related semiconductor packaging engineering experience
Strong knowledge of microelectronic package structure, mechanical, electrical and thermal performance
Expertise in Outsourced Semiconductor Assembly and Test (OSAT)
Knowledge of complex RF designs
Strong communication and collaboration skills
Compensation and Benefits The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law. This job is not eligible for bonuses, incentives or commissions.
EEO Statement Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
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