Senior RF Packaging Engineer - Microelectronics (Hybrid)

A leading communications technology firm is seeking a Senior Packaging Engineer (Microelectronics) in Tempe, AZ. You will play a key role in developing next-generation packaging solutions for RF communications products. Responsibilities include defining package structures, leading technical engagements with vendors, and driving the full development lifecycle. Ideal candidates should have a Bachelors degree in Electrical Engineering and eight years of experience in semiconductor packaging. Comprehensive benefits and a hybrid work model are offered.

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