
Senior Packaging Solutions Engineer – Key Account Lead
Intel Corporation, Phoenix, AZ, United States
A leading semiconductor company seeks a Packaging and Test Account Technical Solutions Engineer in Phoenix, AZ. The successful candidate will manage customer relationships, provide technical solutions for semiconductor packaging, and collaborate across teams. Candidates must have at least 10 years of industry experience and a degree in a related field. The role offers competitive compensation and requires on-site presence. Full benefits package included.
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