Director, Probe and Post Fab

Job Description

Director of Probe & Post‑Fab Operations responsible for end‑to‑end leadership of wafer manufacturing activities from electrical probe through post‑fab processing, including wafer thinning and back side metallization. Owns the transition from electrical qualification to wafer readiness for assembly, accountable for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.

A key responsibility is to define and execute automation strategy for Post‑Fab Operations, ensuring that post‑fab manufacturing systems, controls, and data integration resemble front‑end fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly).

Responsibilities

• Define and execute operational, technical, and automation strategy for Probe & Post‑Fab Operations
• Establish a phased automation roadmap for Post‑Fab, balancing near‑term practicality with long‑term scalability
• Ensure Post‑Fab systems and execution models align with fab‑level manufacturing standards
• Full accountability for yield, cost per wafer, cycle time, and quality from probe through post‑fab
• Lead stable execution of post‑fab operations during automation transitions
• Drive continuous improvement while maintaining production continuity
• Lead the evolution of Post‑Fab Operations toward a fab‑like operating model, including MES usage, tracking, and lot genealogy; SPC, recipe control, and data integrity; standard work and operational discipline
• Establish an automation approach: short‑term tool‑to‑tool transport may remain manual; long‑term material delivery and flow enable automated solutions
• Partner with IT, Manufacturing Systems, and Facilities to ensure scalable, standardized implementation
• Provide oversight of probe strategies and probe card utilization; wafer thickness targets, TTV, warp, and bow controls; back side metallization robustness and compatibility with assembly flows
• Ensure manufacturing readiness for new products and volume ramps
• Build, develop, and retain high‑performing engineering and operations teams; establish clear expectations for managers and technical leaders; promote a culture of discipline, accountability, and continuous improvement
• Serve as the primary interface to Front‑end Fab leadership, Assembly and packaging organizations, Quality, reliability, supply chain, and IT teams; support capital planning, automation investments, and cost‑reduction initiatives

Qualifications

• Bachelor’s degree in engineering or a related technical discipline
• 12+ years of semiconductor manufacturing experience
• Demonstrated leadership in Probe and/or Post‑Fab Operations
• Experience driving manufacturing system standardization and/or automation
• Proven ability to lead organizations through operational change

Preferred

• Advanced degree (MS or PhD)
• Experience leading multi‑area manufacturing organizations
• Thin‑wafer, power, or analog device manufacturing background
• Experience deploying MES, tracking, or automation in non‑fab environments

Salary

Base salary range $164,800 to $296,600 exclusive of fringe benefits or potential bonuses. The final pay rate will depend on geographic location, skills, education, experience, and internal equity considerations. Competitive benefits package available.

Equal Opportunity Employer

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact for assistance.

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