RF-mmWave IC Design & Packaging Engineer

A leading research and innovation hub in Florida is seeking an RF–mmWave IC Design / Packaging Engineer to join their Advanced RF team. You will actively contribute to semiconductor design above 110 GHz, optimize interconnect performance, and collaborate on prototype development. A Master's degree in electrical engineering or related field is required, along with strong communication and semiconductor tapeout experience. This role offers opportunities for innovation in a progressive research environment.
#J-18808-Ljbffr