Advanced Optical Packaging Design Tech Lead
MediaTek, San Jose, CA, United States
Job Overview
Responsible for defining, developing, and delivering advanced optical packaging architectures for next-generation optical engines, silicon photonics products, and co-packaged optics platforms. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.
Responsibilities
Define package architecture and technology direction for advanced optical and optoelectronic products, including optical engines, silicon photonics assemblies, and co-packaged optics platforms.
Lead design and optimization of substrate design, including stack‑up definition, routing topology, via strategy, escape planning, impedance control, and manufacturability tradeoffs.
Drive optical, electrical, mechanical, and thermal co‑design across package development to achieve robust product performance and integration.
Lead development and integration of hybrid bonding solutions for fine‑pitch die integration and advanced package assembly.
Establish design methodology for warpage analysis, thermo‑mechanical modeling, material interaction assessment, and package robustness through assembly and reliability conditions.
Own signal integrity strategy for high‑speed package and substrate interconnects, including channel loss, discontinuities, crosstalk, impedance control, and interface optimization.
Define package design rules, interconnect architecture, and integration guidelines that scale across multiple product generations.
Partner closely with PIC, IC, systems, packaging, test, reliability, operations, and manufacturing teams to close design trade‑offs and drive execution.
Work directly with OSATs, foundries, substrate suppliers, and ecosystem partners to enable scalable and production‑worthy packaging solutions.
Lead root‑cause analysis and technical resolution of package performance, yield, assembly, and reliability issues.
Mentor engineers across disciplines and contribute to package design methodology, technical reviews, and engineering best practices.
Qualifications
Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field with 7+ years of experience, 10+ years for Distinguished Engineer.
Significant experience in advanced semiconductor packaging, optoelectronic packaging, photonics packaging, or heterogeneous integration for high‑performance products.
Deep expertise in advanced optical packaging architecture and package/substrate co‑design.
Strong hands‑on experience advanced substrate design.
Strong experience with hybrid bonding, including design implications, process integration, assembly considerations, and reliability tradeoffs.
Strong background in warpage analysis, thermo‑mechanical behavior, material interactions, and package reliability.
Strong command of signal integrity for high‑speed package and substrate interconnects.
Experience defining substrate stack‑ups, routing strategies, interconnect architectures, and design‑for‑manufacturability requirements.
Proven cross‑functional leadership across PIC, IC, systems, packaging, reliability, manufacturing, and supplier organizations.
Experience bringing advanced packaging technologies from concept through prototype, qualification, and production ramp.
Strong technical communication skills and the ability to influence architecture and roadmap decisions across the organization.
Preferred Qualifications
Experience with silicon photonics, co‑packaged optics, optical modules, or AI networking hardware.
Experience working with OSATs, substrate suppliers, foundries, and manufacturing partners.
Familiarity with optical alignment, fiber attach, laser integration, photodiode integration, or active/passive optical assembly methods.
Experience with design and simulation tools such as Cadence APD/Allegro, ANSYS, HFSS, CST, KLayout, COMSOL, or similar platforms.
Experience with 2.5D/3D integration, flip chip assembly, chiplets, fine‑pitch interconnects, or related advanced package technologies.
Salary & Benefits
Salary range: $211,000 - $356,000 annually. Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual’s skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, company paid holidays, paid time off (PTO), parental leave, 401(k) and more.
EEO Statement
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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Responsible for defining, developing, and delivering advanced optical packaging architectures for next-generation optical engines, silicon photonics products, and co-packaged optics platforms. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.
Responsibilities
Define package architecture and technology direction for advanced optical and optoelectronic products, including optical engines, silicon photonics assemblies, and co-packaged optics platforms.
Lead design and optimization of substrate design, including stack‑up definition, routing topology, via strategy, escape planning, impedance control, and manufacturability tradeoffs.
Drive optical, electrical, mechanical, and thermal co‑design across package development to achieve robust product performance and integration.
Lead development and integration of hybrid bonding solutions for fine‑pitch die integration and advanced package assembly.
Establish design methodology for warpage analysis, thermo‑mechanical modeling, material interaction assessment, and package robustness through assembly and reliability conditions.
Own signal integrity strategy for high‑speed package and substrate interconnects, including channel loss, discontinuities, crosstalk, impedance control, and interface optimization.
Define package design rules, interconnect architecture, and integration guidelines that scale across multiple product generations.
Partner closely with PIC, IC, systems, packaging, test, reliability, operations, and manufacturing teams to close design trade‑offs and drive execution.
Work directly with OSATs, foundries, substrate suppliers, and ecosystem partners to enable scalable and production‑worthy packaging solutions.
Lead root‑cause analysis and technical resolution of package performance, yield, assembly, and reliability issues.
Mentor engineers across disciplines and contribute to package design methodology, technical reviews, and engineering best practices.
Qualifications
Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field with 7+ years of experience, 10+ years for Distinguished Engineer.
Significant experience in advanced semiconductor packaging, optoelectronic packaging, photonics packaging, or heterogeneous integration for high‑performance products.
Deep expertise in advanced optical packaging architecture and package/substrate co‑design.
Strong hands‑on experience advanced substrate design.
Strong experience with hybrid bonding, including design implications, process integration, assembly considerations, and reliability tradeoffs.
Strong background in warpage analysis, thermo‑mechanical behavior, material interactions, and package reliability.
Strong command of signal integrity for high‑speed package and substrate interconnects.
Experience defining substrate stack‑ups, routing strategies, interconnect architectures, and design‑for‑manufacturability requirements.
Proven cross‑functional leadership across PIC, IC, systems, packaging, reliability, manufacturing, and supplier organizations.
Experience bringing advanced packaging technologies from concept through prototype, qualification, and production ramp.
Strong technical communication skills and the ability to influence architecture and roadmap decisions across the organization.
Preferred Qualifications
Experience with silicon photonics, co‑packaged optics, optical modules, or AI networking hardware.
Experience working with OSATs, substrate suppliers, foundries, and manufacturing partners.
Familiarity with optical alignment, fiber attach, laser integration, photodiode integration, or active/passive optical assembly methods.
Experience with design and simulation tools such as Cadence APD/Allegro, ANSYS, HFSS, CST, KLayout, COMSOL, or similar platforms.
Experience with 2.5D/3D integration, flip chip assembly, chiplets, fine‑pitch interconnects, or related advanced package technologies.
Salary & Benefits
Salary range: $211,000 - $356,000 annually. Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual’s skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, company paid holidays, paid time off (PTO), parental leave, 401(k) and more.
EEO Statement
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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