Assembly Operator
Heico, Sunnyvale, CA, United States
Job Description
Pyramid Semiconductor, part of the HEICO group ( www.heico.com , NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.
Role: We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.
Main responsibilities :
Performs die attach of die to various packages.
Performs bonding of the devices using the bonders in the assembly area.
Clip the devices with lids and performs sealing of the devices.
Coordinates various tasks in assembly for optimum performance.
Requirements
Key qualifications :
High school diploma or equivalent required.
10+ years of experience in a semiconductor manufacturing environment, including wire bonding.
Ability to work in a cleanroom environment.
Ability to follow instructions, work in a team environment, and assist where needed.
Compensation and benefits:
BCBS and Kaiser medical plans with different options
Dental and vision plans
401(k) with employer match
Sick and Vacation time
Health Savings Account (HSA) with Company Contributions
And more...
We are committed to providing our employees with opportunities for growth and development.
Pyramid Semiconductor, part of the HEICO group ( www.heico.com , NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.
Role: We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.
Main responsibilities :
Performs die attach of die to various packages.
Performs bonding of the devices using the bonders in the assembly area.
Clip the devices with lids and performs sealing of the devices.
Coordinates various tasks in assembly for optimum performance.
Requirements
Key qualifications :
High school diploma or equivalent required.
10+ years of experience in a semiconductor manufacturing environment, including wire bonding.
Ability to work in a cleanroom environment.
Ability to follow instructions, work in a team environment, and assist where needed.
Compensation and benefits:
BCBS and Kaiser medical plans with different options
Dental and vision plans
401(k) with employer match
Sick and Vacation time
Health Savings Account (HSA) with Company Contributions
And more...
We are committed to providing our employees with opportunities for growth and development.