
eCAD Design Engineer | Lorven Technologies | Austin, TX
Lorven Technologies, Austin, TX, United States
Job Title: eCAD Design Engineer | Lorven Technologies | Austin, TX
Recruiting Company: Lorven Technologies
Job Location: Austin, Texas (Day‑1 Onsite)
Job Type: Full-Time, Onsite
Application Method: Send resume to Ganesh.ra@lorventech.com
Priority: Very High Priority – Immediate Joiners Preferred
Overview
Lorven Technologies is seeking an experienced eCAD Design Engineer with deep expertise in PCB layout and design using Cadence Allegro 17.2/17.4. This role is critical in supporting complex digital, analog, mixed‑signal, and RF board development for high‑performance hardware products.
Responsibilities
Perform PCB ECAD design using Cadence Allegro 17.2 / 17.4 (Mandatory)
Own the full schematic‑to‑Gerber process and final release
Execute PCB placement, routing, layer stack‑up, and constraint setup
Apply high‑speed routing principles including length matching, creepage & clearance, and power plane optimization
Design for digital, analog, mixed‑signal, and RF hardware applications
Support and design RF boards and related subsystems
Apply constraints using Allegro Constraint Manager
Work with high‑speed interfaces such as DDR4/DDR5, PCIe, USB, SATA, Ethernet, PMIC
Prepare detailed documentation, fab drawings, and Gerber files for manufacturing
Collaborate with customers and internal engineering teams
Mentor junior engineers and provide technical guidance
Ensure compliance with industry, electrical, and manufacturing standards
Required Qualifications & Skills
Strong hands‑on experience in PCB ECAD design and library management
Expertise with Cadence Allegro 17.2/17.4
Solid understanding of high‑speed PCB design and signal integrity concepts
Knowledge of PCB manufacturing processes and IPC standards
Ability to design complex multilayer and high‑density PCBs
Excellent communication, documentation, and teamwork skills
Nice‑to‑Have Skills
Experience with RF board design and RF testing principles
Familiarity with power integrity analysis tools
Background in consumer electronics, semiconductor, or telecom hardware
Exposure to EMC/EMI compliance and design practices
Experience in mentoring or leading small engineering groups
Recruitment Pro Tip
Showcase specific PCB designs you’ve delivered—especially those involving high‑speed interfaces or RF components—and highlight the tools, constraints, and challenges you managed; this instantly positions you as a strong technical fit.
#J-18808-Ljbffr
Recruiting Company: Lorven Technologies
Job Location: Austin, Texas (Day‑1 Onsite)
Job Type: Full-Time, Onsite
Application Method: Send resume to Ganesh.ra@lorventech.com
Priority: Very High Priority – Immediate Joiners Preferred
Overview
Lorven Technologies is seeking an experienced eCAD Design Engineer with deep expertise in PCB layout and design using Cadence Allegro 17.2/17.4. This role is critical in supporting complex digital, analog, mixed‑signal, and RF board development for high‑performance hardware products.
Responsibilities
Perform PCB ECAD design using Cadence Allegro 17.2 / 17.4 (Mandatory)
Own the full schematic‑to‑Gerber process and final release
Execute PCB placement, routing, layer stack‑up, and constraint setup
Apply high‑speed routing principles including length matching, creepage & clearance, and power plane optimization
Design for digital, analog, mixed‑signal, and RF hardware applications
Support and design RF boards and related subsystems
Apply constraints using Allegro Constraint Manager
Work with high‑speed interfaces such as DDR4/DDR5, PCIe, USB, SATA, Ethernet, PMIC
Prepare detailed documentation, fab drawings, and Gerber files for manufacturing
Collaborate with customers and internal engineering teams
Mentor junior engineers and provide technical guidance
Ensure compliance with industry, electrical, and manufacturing standards
Required Qualifications & Skills
Strong hands‑on experience in PCB ECAD design and library management
Expertise with Cadence Allegro 17.2/17.4
Solid understanding of high‑speed PCB design and signal integrity concepts
Knowledge of PCB manufacturing processes and IPC standards
Ability to design complex multilayer and high‑density PCBs
Excellent communication, documentation, and teamwork skills
Nice‑to‑Have Skills
Experience with RF board design and RF testing principles
Familiarity with power integrity analysis tools
Background in consumer electronics, semiconductor, or telecom hardware
Exposure to EMC/EMI compliance and design practices
Experience in mentoring or leading small engineering groups
Recruitment Pro Tip
Showcase specific PCB designs you’ve delivered—especially those involving high‑speed interfaces or RF components—and highlight the tools, constraints, and challenges you managed; this instantly positions you as a strong technical fit.
#J-18808-Ljbffr