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Senior HBM Design Architect for Next-Gen Memory

Micron Technology, Inc, Boise, ID, United States


A leading semiconductor firm is seeking a Principal HBM Design Architect to design and optimize advanced DRAM circuits for high-performance solutions. In this role, you will collaborate with global teams on innovative HBM products aimed at AI and ML applications. The ideal candidate will possess strong experience in CMOS circuit design and semiconductor device physics, with the ability to analyze complex designs. Join us to impact the future of technology significantly.
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