Lead Photonics PIC Design & Team Tech Leader
Langham Recruitment, New Bremen, OH, United States
Germany-based Company
We’re hiring across for a Lead / Team Lead Photonics PIC Design role within a globally distributed engineering team developing next-generation PIC chips and transceivers for data-centre applications.
Depending on your experience, you’ll take on a hands-on technical design role or a broader technical leadership position, contributing to the design, simulation, and integration of high-speed active silicon photonics devices—including modulators targeting 200 Gb/s and 400 Gb/s.
Key Responsibilities
Design and develop active photonic devices for O-band and C-band applications
Model electro-optic device behaviour under both static and transient RF conditions
Simulate photonic integrated circuits on SOI platforms
Partner with cross-functional teams on system-level channel simulations
Establish and evolve scalable design methodologies and development environments
What We’re Looking For
PhD in Electrical Engineering, Physics, or a closely related discipline
8+ years of relevant industry experience
Deep expertise in FDTD, eigenmode expansion, and TCAD simulation techniques
Experience with RF circuit design and PIC/EIC design tools (e.g. Lumerical suite, HFSS)
Demonstrated end-to-end PIC design experience, from specifications through tape-out
Object-oriented programming skills
Strong analytical, communication, and collaboration abilities
Fluency in English (German is a plus)
What’s on Offer
Stock options
Significant ownership and autonomy within a flat organisational structure
A rapidly growing international team in a highly motivating environment
#J-18808-Ljbffr
We’re hiring across for a Lead / Team Lead Photonics PIC Design role within a globally distributed engineering team developing next-generation PIC chips and transceivers for data-centre applications.
Depending on your experience, you’ll take on a hands-on technical design role or a broader technical leadership position, contributing to the design, simulation, and integration of high-speed active silicon photonics devices—including modulators targeting 200 Gb/s and 400 Gb/s.
Key Responsibilities
Design and develop active photonic devices for O-band and C-band applications
Model electro-optic device behaviour under both static and transient RF conditions
Simulate photonic integrated circuits on SOI platforms
Partner with cross-functional teams on system-level channel simulations
Establish and evolve scalable design methodologies and development environments
What We’re Looking For
PhD in Electrical Engineering, Physics, or a closely related discipline
8+ years of relevant industry experience
Deep expertise in FDTD, eigenmode expansion, and TCAD simulation techniques
Experience with RF circuit design and PIC/EIC design tools (e.g. Lumerical suite, HFSS)
Demonstrated end-to-end PIC design experience, from specifications through tape-out
Object-oriented programming skills
Strong analytical, communication, and collaboration abilities
Fluency in English (German is a plus)
What’s on Offer
Stock options
Significant ownership and autonomy within a flat organisational structure
A rapidly growing international team in a highly motivating environment
#J-18808-Ljbffr