Principal Package Thermal Mechanical Engineer – System Design

A cutting-edge technology company in California is seeking a Principal Package Thermal & Mechanical Engineer to drive innovative IC packaging solutions for AI systems. You will lead thermal and mechanical modeling while collaborating with design and manufacturing teams. Ideal candidates have at least 8 years of experience in semiconductor packaging and strong expertise in thermal and mechanical modeling tools. This position offers a competitive salary and fosters a diverse and inclusive work environment.
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