Senior IC Package Design Engineer - Flip-Chip BGA (On-site)

A leading semiconductor company seeking an experienced Package Design Engineer to design complex flip-chip-BGA packages for high-performance ASICs in Austin, Texas. The ideal candidate should have extensive experience in package design and management. Responsibilities include overseeing projects related to signal integrity and collaborating with global teams. The role offers a competitive salary range and a comprehensive benefits package, making it an attractive opportunity for qualified professionals.
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