Senior IC Package Design Engineer – High-Speed SiP & RF

A leading technology firm in California is seeking an experienced IC Package Design Engineer to manage and optimize packaging solutions for innovative consumer electronics. The role involves physical design of various chips, interfacing with diverse teams, and will require deep knowledge in electrical, thermal, and mechanical engineering principles. Candidates should possess over 10 years of relevant experience and proficiency in tools like Cadence Allegro. A commitment to detail and collaboration in a high-paced environment is essential.
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