Failure Analysis Technician F21
TSMC - Taiwan Semiconductor Manufacturing Company Limited, Phoenix, AZ, United States
Failure Analysis Technician
TSMC Arizona, located in the 5‑nanometer fab in Phoenix, Arizona, is looking for a Failure Analysis Technician. The role requires a strong sense of chip failure analysis and a commitment to integrity, innovation, and customer trust.
Responsibilities:
Operate FIB to prepare PFA samples, SEM, C‑AFM and nano‑probe tools for analysis and reporting.
Prepare TEM samples, including site marking, de‑layering, and other necessary pre‑treatment steps.
Handle chemicals safely with PPE.
Collect and organize data and report to engineers.
Assist engineers with analytical method development.
Maintain laboratory housekeeping (6S) environment and protocols.
Support Fab manufacturing operations and participate in on‑call schedule.
Minimum Qualifications:
Associate degree (A.A.S.) or Bachelor’s degree in Science/Engineering/Technology or equivalent education (preferred but not required).
Experience in TEM sample preparation for semiconductor devices in advanced process nodes ( Experience/skill in HR‑STEM imaging and EDS analysis (preferred but not required).
Ability to work independently, prioritize tasks, and meet deadlines.
Team player with a positive attitude and strong work ethic.
Ability to handle pressure in a fast‑paced environment.
Availability for night and weekend shifts, and overtime when needed.
Possible work in a clean room environment (Near‑line FIB/TEM).
Basic PC skills (MS Windows OS and MS Office) required.
Work Location: Phoenix, AZ
Training Location: Phoenix, AZ
Travel: 0%
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TSMC Arizona, located in the 5‑nanometer fab in Phoenix, Arizona, is looking for a Failure Analysis Technician. The role requires a strong sense of chip failure analysis and a commitment to integrity, innovation, and customer trust.
Responsibilities:
Operate FIB to prepare PFA samples, SEM, C‑AFM and nano‑probe tools for analysis and reporting.
Prepare TEM samples, including site marking, de‑layering, and other necessary pre‑treatment steps.
Handle chemicals safely with PPE.
Collect and organize data and report to engineers.
Assist engineers with analytical method development.
Maintain laboratory housekeeping (6S) environment and protocols.
Support Fab manufacturing operations and participate in on‑call schedule.
Minimum Qualifications:
Associate degree (A.A.S.) or Bachelor’s degree in Science/Engineering/Technology or equivalent education (preferred but not required).
Experience in TEM sample preparation for semiconductor devices in advanced process nodes ( Experience/skill in HR‑STEM imaging and EDS analysis (preferred but not required).
Ability to work independently, prioritize tasks, and meet deadlines.
Team player with a positive attitude and strong work ethic.
Ability to handle pressure in a fast‑paced environment.
Availability for night and weekend shifts, and overtime when needed.
Possible work in a clean room environment (Near‑line FIB/TEM).
Basic PC skills (MS Windows OS and MS Office) required.
Work Location: Phoenix, AZ
Training Location: Phoenix, AZ
Travel: 0%
#J-18808-Ljbffr