Staff Product Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group(H
Micron Technology, Boise, ID, United States
Responsibilities
Collaborate with the Advanced Package Technology team to enable sophisticated interconnect solutions, including wafer-to-wafer bonding.
Work with the Test Solutions team to develop and enable test solutions, providing analysis of yield and electrical characteristics data.
Conduct electrical failure analysis and develop design-for-test (DFT) concepts and characteristic data for advanced packaging solutions.
Perform electrical and mechanical failure analysis (EFA) of advanced packaging failures, extracting and providing relevant data.
Mentor and develop team members to cultivate growth and development within the organization.
Coordinate closely with cross‑functional teams, such as Advanced Packaging, Design, Test Solution, and Yield Engineering, to ensure multidisciplinary development and successful enablement.
Develop and strengthen project‑management skills within the team to ensure efficient execution and timely delivery of technological solutions.
Make final decisions on risk analysis and project prioritization, influencing the direction of technological development.
Minimum Qualifications
Bachelor’s, Master’s, or Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or a related field.
Minimum of 10 years’ experience in the semiconductor industry.
Deep knowledge of sophisticated package processes/integration and memory technologies such as DRAM.
Excellent data extraction, analysis, and reporting skills (e.g., JMP or comparable tools).
Will be based in the United States with international travel to Singapore and Taiwan.
Preferred Qualifications
Familiarity with memory testing methodology.
Dedicated and highly motivated with a flexible approach toward different roles in a dynamic environment, from team leadership to technical program leadership.
Strong record of collaboration within and across teams to address complex business and engineering problems.
Will be based in the United States with international travel to Singapore and Taiwan.
Benefits
Micron offers a range of health, dental, and vision plans with flexibility to meet individual and family needs. Additional benefit programs protect income during illness or injury and include paid family leave. Micron provides a robust paid time‑off program and paid holidays. Detailed information is available in the Benefits Guide on micron.com/careers/benefits.
Equal Opportunity Employment
Micron is an equal‑opportunity employer and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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Collaborate with the Advanced Package Technology team to enable sophisticated interconnect solutions, including wafer-to-wafer bonding.
Work with the Test Solutions team to develop and enable test solutions, providing analysis of yield and electrical characteristics data.
Conduct electrical failure analysis and develop design-for-test (DFT) concepts and characteristic data for advanced packaging solutions.
Perform electrical and mechanical failure analysis (EFA) of advanced packaging failures, extracting and providing relevant data.
Mentor and develop team members to cultivate growth and development within the organization.
Coordinate closely with cross‑functional teams, such as Advanced Packaging, Design, Test Solution, and Yield Engineering, to ensure multidisciplinary development and successful enablement.
Develop and strengthen project‑management skills within the team to ensure efficient execution and timely delivery of technological solutions.
Make final decisions on risk analysis and project prioritization, influencing the direction of technological development.
Minimum Qualifications
Bachelor’s, Master’s, or Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or a related field.
Minimum of 10 years’ experience in the semiconductor industry.
Deep knowledge of sophisticated package processes/integration and memory technologies such as DRAM.
Excellent data extraction, analysis, and reporting skills (e.g., JMP or comparable tools).
Will be based in the United States with international travel to Singapore and Taiwan.
Preferred Qualifications
Familiarity with memory testing methodology.
Dedicated and highly motivated with a flexible approach toward different roles in a dynamic environment, from team leadership to technical program leadership.
Strong record of collaboration within and across teams to address complex business and engineering problems.
Will be based in the United States with international travel to Singapore and Taiwan.
Benefits
Micron offers a range of health, dental, and vision plans with flexibility to meet individual and family needs. Additional benefit programs protect income during illness or injury and include paid family leave. Micron provides a robust paid time‑off program and paid holidays. Detailed information is available in the Benefits Guide on micron.com/careers/benefits.
Equal Opportunity Employment
Micron is an equal‑opportunity employer and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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