R&D Manager - Thermal Solutions
Actalent, Westwood, MA, United States
Description
Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging.
Apply structure–property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution.
Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance.
Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions.
Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments.
Translate material-level results into package- and system-level performance implications.
Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.
Customer & Market Engagement
Lead customer-facing technical engagement for thermal interface and potting materials in advanced semiconductor packaging.
Translate customer requirements into R&D priorities while maintaining a focus on technology leadership.
Partner with hyperscalers and contract manufacturers to accelerate adoption of next-generation thermal solutions in AI and data center applications.
Cross-Functional Collaboration
Partner with Product Development, Manufacturing, and Marketing to ensure formulations are scalable, manufacturable, and aligned with portfolio strategy.
Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.
Additional Skills & Qualifications
7+ years of industry experience developing, formulating, or validating polymer-based materials for semiconductor packaging, electronics assembly, thermal interface materials, or other high-reliability applications.
Strong applied understanding of polymer chemistry, composite formulation, and additive systems, with the ability to link formulation design to thermomechanical performance.
Experience applying structure–property relationships to manage performance trade-offs across TIM1, TIM1.5, TIM2, and potting compound applications.
Working knowledge of PCB- and advanced-package-level thermal and mechanical environments, including processor packaging, lids/stiffeners, cold plates, and TIM selection and reliability considerations.
Bachelor’s degree in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or a related discipline. Advanced degrees preferred.
Experience Level
Expert Level
Job Type & Location
This is a Permanent position based out of Westwood, MA.
Pay And Benefits
The pay range for this position is $150,000.00 - $160,000.00/yr.
Health, Vision, Dental, 401K
Workplace Type
This is a fully onsite position in Westwood, MA.
Equal Opportunity Employer
Actalent is an equal opportunity employer.
#J-18808-Ljbffr
Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging.
Apply structure–property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution.
Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance.
Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions.
Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments.
Translate material-level results into package- and system-level performance implications.
Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.
Customer & Market Engagement
Lead customer-facing technical engagement for thermal interface and potting materials in advanced semiconductor packaging.
Translate customer requirements into R&D priorities while maintaining a focus on technology leadership.
Partner with hyperscalers and contract manufacturers to accelerate adoption of next-generation thermal solutions in AI and data center applications.
Cross-Functional Collaboration
Partner with Product Development, Manufacturing, and Marketing to ensure formulations are scalable, manufacturable, and aligned with portfolio strategy.
Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.
Additional Skills & Qualifications
7+ years of industry experience developing, formulating, or validating polymer-based materials for semiconductor packaging, electronics assembly, thermal interface materials, or other high-reliability applications.
Strong applied understanding of polymer chemistry, composite formulation, and additive systems, with the ability to link formulation design to thermomechanical performance.
Experience applying structure–property relationships to manage performance trade-offs across TIM1, TIM1.5, TIM2, and potting compound applications.
Working knowledge of PCB- and advanced-package-level thermal and mechanical environments, including processor packaging, lids/stiffeners, cold plates, and TIM selection and reliability considerations.
Bachelor’s degree in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or a related discipline. Advanced degrees preferred.
Experience Level
Expert Level
Job Type & Location
This is a Permanent position based out of Westwood, MA.
Pay And Benefits
The pay range for this position is $150,000.00 - $160,000.00/yr.
Health, Vision, Dental, 401K
Workplace Type
This is a fully onsite position in Westwood, MA.
Equal Opportunity Employer
Actalent is an equal opportunity employer.
#J-18808-Ljbffr