Media & Collateral Engineering Specialist

Dormont Manufacturing Co is seeking an experienced hire to develop media and collaterals for assembly processes in Phoenix, Arizona. The candidate will apply innovative solutions for Intel’s assembly packaging technologies and will require a strong understanding of mechanical design and semiconductor processes.
Minimum qualifications include a degree in Mechanical or Electrical Engineering and relevant project experience. With a competitive compensation package, this role offers a significant opportunity for technical innovation and project delivery.

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