Media & Collateral Development Engineer - Semiconductor Packaging

Intel Corporation in Phoenix, AZ seeks an experienced materials and packaging technologist to develop media and collateral for assembly processes. You will optimize media quality, investigate DOE/ SPC driven improvements, and contribute to design of experiments to meet reliability and manufacturability goals.
Role requires onsite presence, with a focus on advancing packaging technology, prototyping, and collaboration with cross-functional teams to meet milestones and reduce risk in manufacturing

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