Micron Technology, Inc. is seeking a Director of DRAM Packaging to drive strategy, development, and execution of advanced packaging across memory portfolios.
You will define roadmaps, lead a global engineering organization, and partner across design, manufacturing, quality, and supply chain to deliver state-of-the-art packaging solutions. In this executive role you will build scalable processes, advance AI-driven design and digital engineering, and shape technology investments while maintaining
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Director, DRAM Packaging: AI-Driven 3D/HBM Innovation
Micron Technology · Boise, ID, USA ·
- Job type:
- Full Time