Renesas Electronics Corp. is seeking a senior specialist in package technology development to lead NPI/R&D and OSAT management for new power packaging solutions. Focus areas include AI/datacenter power packaging, SiP/module design, and advanced interconnects.
You will work with product and reliability teams to qualify new packages and establish process specs. The role requires 15–20 years in package development, strong knowledge of wafer-level/flip-chip packaging, and excellent analytical #J-18808-Ljbffr
Director, Power Package Design & SiP Innovation
Renesas · California, MO, USA ·
- Job type:
- Full Time