Senior RFIC Packaging Designer - 50 GHz, High-Frequency

A semiconductor research company in Atlanta is seeking an IC Packaging Designer to develop innovative packaging solutions for RF integrated circuits. This full-time, onsite role involves designing and optimizing complex packages for high-frequency performance while collaborating closely with RFIC designers and testing teams. Ideal candidates will have a Bachelor's degree in a relevant field and 3-5 years of experience in RFIC semiconductor packaging. A competitive salary and comprehensive benefits package are offered. #J-18808-Ljbffr