Senior IC Packaging Designer
Falcomm, Atlanta, GA, United States
Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III‑V MMIC devices into production‑ready packages.
Responsibilities
Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages
Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools
Work with signal integrity, EM, and thermal simulation teams to validate package performance.
Generate package documentation, fabrication drawings, and assembly specifications
Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield
Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss
Support package integration with PCB design teams to ensure optimal RF performance at the system level
Coordinate with fabrication and assembly partners
Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline
3‑5 years of experience designing advanced RFIC semiconductor packages up to 50 GHz (e.g., wirebond, flip‑chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition
Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging
Must be willing to work full‑time, onsite, in Atlanta, GA.
Preferred Skills
Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high‑speed interface requirements such as DDR or PCIe
Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre
Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows
Ability to build accurate 3‑D models of packages using Ansys Electronics Desktop, EM‑simulate them in HFSS, and run thermal simulations on them with Icepak
Benefits
Competitive Salary and Equity Package
Comprehensive Health, Dental, and Vision Insurance
401(k) Retirement Plan
Paid Time Off (PTO) and Sick Leave
Disclosure
Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status
Applicants wishing to view a copy of Falcomm's Aff‑Word Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm
To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State
#J-18808-Ljbffr
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III‑V MMIC devices into production‑ready packages.
Responsibilities
Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages
Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools
Work with signal integrity, EM, and thermal simulation teams to validate package performance.
Generate package documentation, fabrication drawings, and assembly specifications
Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield
Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss
Support package integration with PCB design teams to ensure optimal RF performance at the system level
Coordinate with fabrication and assembly partners
Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline
3‑5 years of experience designing advanced RFIC semiconductor packages up to 50 GHz (e.g., wirebond, flip‑chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition
Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging
Must be willing to work full‑time, onsite, in Atlanta, GA.
Preferred Skills
Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high‑speed interface requirements such as DDR or PCIe
Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre
Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows
Ability to build accurate 3‑D models of packages using Ansys Electronics Desktop, EM‑simulate them in HFSS, and run thermal simulations on them with Icepak
Benefits
Competitive Salary and Equity Package
Comprehensive Health, Dental, and Vision Insurance
401(k) Retirement Plan
Paid Time Off (PTO) and Sick Leave
Disclosure
Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status
Applicants wishing to view a copy of Falcomm's Aff‑Word Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm
To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State
#J-18808-Ljbffr