Director Advanced Packaging (2.5D/3D)– Advanced Materials & Thermal Integration
Destination 2D, San Jose, CA, United States
Senior Packaging Engineer – Advanced Materials & Thermal Integration
Location: San Jose, CA
Company: Destination 2D Inc.
Destination 2D is pioneering CMOS-compatible graphene technologies that are redefining semiconductor performance—from beyond-copper interconnects to next-generation thermal management and heterogeneous integration.
We’re looking for an exceptional Senior Packaging Engineer to help translate these groundbreaking materials into scalable, manufacturable packaging solutions for future computing platforms.
What You’ll Do
Architect and evaluate advanced packaging solutions that leverage emerging materials with superior thermal and mechanical properties.
Develop integration pathways for graphene and other 2D materials in next-generation packaging and heterogeneous integration platforms.
Analyze and optimize thermal transport, power delivery, and structural reliability in advanced packages.
Collaborate closely with device, materials, and process engineers to bring novel materials from concept to manufacturing.
Contribute to technical publications, patents, and technology roadmaps shaping the future of semiconductor packaging.
Who You Are
PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
7+ years of experience in advanced semiconductor packaging or heterogeneous integration.
Experience working with emerging or novel materials for thermal management or packaging innovation.
Proven track record of technical leadership, publications, or patents in packaging, thermal transport, or materials engineering.
Deep understanding of heat transfer, power delivery, reliability, and system-level integration.
Join us in shaping how graphene and other atomically engineered materials redefine semiconductor packaging for the AI and high-performance computing era.
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Company: Destination 2D Inc.
Destination 2D is pioneering CMOS-compatible graphene technologies that are redefining semiconductor performance—from beyond-copper interconnects to next-generation thermal management and heterogeneous integration.
We’re looking for an exceptional Senior Packaging Engineer to help translate these groundbreaking materials into scalable, manufacturable packaging solutions for future computing platforms.
What You’ll Do
Architect and evaluate advanced packaging solutions that leverage emerging materials with superior thermal and mechanical properties.
Develop integration pathways for graphene and other 2D materials in next-generation packaging and heterogeneous integration platforms.
Analyze and optimize thermal transport, power delivery, and structural reliability in advanced packages.
Collaborate closely with device, materials, and process engineers to bring novel materials from concept to manufacturing.
Contribute to technical publications, patents, and technology roadmaps shaping the future of semiconductor packaging.
Who You Are
PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
7+ years of experience in advanced semiconductor packaging or heterogeneous integration.
Experience working with emerging or novel materials for thermal management or packaging innovation.
Proven track record of technical leadership, publications, or patents in packaging, thermal transport, or materials engineering.
Deep understanding of heat transfer, power delivery, reliability, and system-level integration.
Join us in shaping how graphene and other atomically engineered materials redefine semiconductor packaging for the AI and high-performance computing era.
#J-18808-Ljbffr