Packaging Architect Design Engineer
Broadcom, Irvine, CA, United States
Job Description
Hiring a talent in advanced packaging design with intensive hands‑on experience in GDSII‑based physical layout and in‑depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm‑based layout is a plus.
Job Scope
Architect advanced packaging solution to meet future product requirements
Define design rules for the new technology
Design (with physical layout) test vehicles to support technology development
Generation of design collaterals for new technology introduction
Drive design‑for‑yield and design‑for‑cost activities after a new technology is in production
Education / Experience
Bachelor's degree in Engineering and 5+ years of related experience or Masters degree in Engineering and 3+ years of related experience
Compensation and Benefits
The annual base salary range for this position is $91,000 - $146,000. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Equal Opportunity Statement
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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Hiring a talent in advanced packaging design with intensive hands‑on experience in GDSII‑based physical layout and in‑depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm‑based layout is a plus.
Job Scope
Architect advanced packaging solution to meet future product requirements
Define design rules for the new technology
Design (with physical layout) test vehicles to support technology development
Generation of design collaterals for new technology introduction
Drive design‑for‑yield and design‑for‑cost activities after a new technology is in production
Education / Experience
Bachelor's degree in Engineering and 5+ years of related experience or Masters degree in Engineering and 3+ years of related experience
Compensation and Benefits
The annual base salary range for this position is $91,000 - $146,000. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Equal Opportunity Statement
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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