Package Layout Design Engineer – 2.5D/3D IC Packaging

A leading tech company is seeking a Package Layout Design Engineer to contribute to the physical design of advanced IC packages for next-generation solutions. Responsibilities include executing layout tasks, implementing advanced packaging architectures, and collaborating with various engineering teams. The ideal candidate should have a Bachelor's degree in Electrical Engineering, 5+ years of relevant experience, and hands-on skills with layout tools like Cadence APD. Competitive compensation and comprehensive benefits are offered.
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