Package Layout Design Engineer – 2.5D/3D IC Packaging

A leading technology firm in Austin is seeking a Package Layout Design Engineer to contribute to the design of innovative IC packages for machine learning and data center ASICs. The role involves executing layout tasks, collaborating with multiple teams to ensure production-ready designs meet performance targets. Ideal candidates possess a Bachelor's degree in Electrical Engineering, over 5 years experience in IC package layout, and familiarity with package design tools. This opportunity offers a competitive compensation package and comprehensive benefits.
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