Headway Technologies is hiring: Thin Film Process Engineering Technician (50480)
Headway Technologies, Milpitas, CA, United States
Overview
Description (Title: THIN FILM PROCESS ENGINEERING TECHNICIAN; FLSA STATUS: NON-EXEMPT)
Reports To: Sr. DIRECTOR, THIN FILM PROCESS ENGINEERING
Location: Milpitas, California
Essential Functions
Provides support to the engineering teams in the thin film area
Supports wafer fabrication and thin film processes to ensure that wafers are processed efficiently
Uses various wafer manufacturing tools such as PVD (Anelva, CVC, PVD, EME, SEED), IBD, CVD, ALD, PECVD, etcher, wet cleaning tool, oven etc., to perform experiments and process wafers
Reviews and documents processes and procedures; partners with engineering to implement changes effectively
Dispositions abnormal or atypical wafers for rework; ensures that rework is completed promptly
Collects and analyzes data and recommends corrective action if required
Reviews and maintains process controls using SPC and prepares charts and graphs
Performs various types of inspections using microscopes
Assists with troubleshooting and resolving process-related issues
Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
Collaborates with engineering to qualify or approve new processes or procedures
Creates reports, charts, or graphs on an ad-hoc or routine basis
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level
Minimum Qualifications
Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience
Two years of experience working in the semiconductor industry
Knowledge of thin film processes and procedures
Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, And Abilities
Knowledge and ability to use various types of microscopes to perform wafer inspection
Knowledge of semiconductor or hard disk drive (HDD) principles and processes
Knowledge and ability to use SPC to maintain process controls
Knowledge of thin film processes and procedures
Ability to collect and analyze data, present findings, and recommend corrective action
Ability to adhere to all safety policies and procedures
Ability to communicate effectively with all levels of employees and management
Demonstrated ability to follow routine verbal or written instructions
Demonstrated problem solving and organizational skills
Demonstrated time management and prioritization skills
Skilled at resolving issues quickly and efficiently
Flexible and able to prioritize
Compensation
The hourly rate for this full-time position is between $26.00-$35.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.
Working Conditions
The Thin Film Process Engineering Technician works primarily in an indoor environment on a rotating schedule for E shift. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; Stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 20 pounds.
Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact Susan Rowatt, Staffing and Compensation Manager, at susan.rowatt@headway.com. Interested applicants should submit their resume to jobs@headway.com.
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Description (Title: THIN FILM PROCESS ENGINEERING TECHNICIAN; FLSA STATUS: NON-EXEMPT)
Reports To: Sr. DIRECTOR, THIN FILM PROCESS ENGINEERING
Location: Milpitas, California
Essential Functions
Provides support to the engineering teams in the thin film area
Supports wafer fabrication and thin film processes to ensure that wafers are processed efficiently
Uses various wafer manufacturing tools such as PVD (Anelva, CVC, PVD, EME, SEED), IBD, CVD, ALD, PECVD, etcher, wet cleaning tool, oven etc., to perform experiments and process wafers
Reviews and documents processes and procedures; partners with engineering to implement changes effectively
Dispositions abnormal or atypical wafers for rework; ensures that rework is completed promptly
Collects and analyzes data and recommends corrective action if required
Reviews and maintains process controls using SPC and prepares charts and graphs
Performs various types of inspections using microscopes
Assists with troubleshooting and resolving process-related issues
Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
Collaborates with engineering to qualify or approve new processes or procedures
Creates reports, charts, or graphs on an ad-hoc or routine basis
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level
Minimum Qualifications
Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience
Two years of experience working in the semiconductor industry
Knowledge of thin film processes and procedures
Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, And Abilities
Knowledge and ability to use various types of microscopes to perform wafer inspection
Knowledge of semiconductor or hard disk drive (HDD) principles and processes
Knowledge and ability to use SPC to maintain process controls
Knowledge of thin film processes and procedures
Ability to collect and analyze data, present findings, and recommend corrective action
Ability to adhere to all safety policies and procedures
Ability to communicate effectively with all levels of employees and management
Demonstrated ability to follow routine verbal or written instructions
Demonstrated problem solving and organizational skills
Demonstrated time management and prioritization skills
Skilled at resolving issues quickly and efficiently
Flexible and able to prioritize
Compensation
The hourly rate for this full-time position is between $26.00-$35.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.
Working Conditions
The Thin Film Process Engineering Technician works primarily in an indoor environment on a rotating schedule for E shift. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; Stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 20 pounds.
Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact Susan Rowatt, Staffing and Compensation Manager, at susan.rowatt@headway.com. Interested applicants should submit their resume to jobs@headway.com.
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