Design Integration Engineer (49386)
Headway Technologies, Milpitas, CA, United States
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, DESIGN INTEGRATION
Summary
SUMMARY:
Under the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.
Description
TITLE: DESIGN INTEGRATION ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, DESIGN INTEGRATION
Summary
SUMMARY:
Under the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.
Essential Functions
Designs and delivers masks and layouts for thin film recording heads
Tracks wafer schedules, mask manufacturing progress in the fab, and vendor interactions to ensure just-in-time delivery of masks, tools, or wafers
Updates, creates, and maintains CAD libraries for layouts as needed
Integrates new recording head designs into the existing design libraries based upon job or customer specifications
Maintains, updates, and documents all design reference materials; ensures readiness of manufacturing materials as needed
Reviews and analyzes data, creates reports, and presents findings to groups, teams, or departments as required
Uses knowledge of TMR, PMR, MAMR or HAMR design integration issues, layouts, and wafer processing to ensure masks are designed efficiently and cost effectively
Interacts with and responds to inquiries from other product groups regarding manufacturing-related issues and product or device modifications or requirements
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level*
Qualifications
MINIMUM QUALIFICATIONS:
Bachelor’s degree in Electrical or Mechanical Engineering and/or equivalent relevant experience; Master’s degree preferred
One to three years of hands-on experience working in the thin film recording head or semiconductor industry in a mask design role
Experience using CAD software such as DW-2000 or AutoCAD
Proficient in the use of Microsoft Office Applications
Knowledge, Skills, And Abilities
Knowledge of thin film recording head manufacturing or semiconductor processes, practices, and techniques
Knowledge and ability to use CAD or similar software to create complex masks and layouts for use in thin film recording heads
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Ability to manage and track wafer schedules, projects, and design changes efficiently to ensure just-in-time delivery of materials or wafers
Ability to create various reports, presentations, and written sample analysis
Ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, vendors, and management
Ability to work productively and collaboratively with all levels of employees and management
Ability to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize
The hourly rate for this full-time position is between $92,930.00-$136,661.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.
Working Conditions
The Design Integration Engineer works primarily in an indoor environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 or more pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
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REPORTS TO: DIRECTOR, DESIGN INTEGRATION
Summary
SUMMARY:
Under the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.
Description
TITLE: DESIGN INTEGRATION ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, DESIGN INTEGRATION
Summary
SUMMARY:
Under the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.
Essential Functions
Designs and delivers masks and layouts for thin film recording heads
Tracks wafer schedules, mask manufacturing progress in the fab, and vendor interactions to ensure just-in-time delivery of masks, tools, or wafers
Updates, creates, and maintains CAD libraries for layouts as needed
Integrates new recording head designs into the existing design libraries based upon job or customer specifications
Maintains, updates, and documents all design reference materials; ensures readiness of manufacturing materials as needed
Reviews and analyzes data, creates reports, and presents findings to groups, teams, or departments as required
Uses knowledge of TMR, PMR, MAMR or HAMR design integration issues, layouts, and wafer processing to ensure masks are designed efficiently and cost effectively
Interacts with and responds to inquiries from other product groups regarding manufacturing-related issues and product or device modifications or requirements
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level*
Qualifications
MINIMUM QUALIFICATIONS:
Bachelor’s degree in Electrical or Mechanical Engineering and/or equivalent relevant experience; Master’s degree preferred
One to three years of hands-on experience working in the thin film recording head or semiconductor industry in a mask design role
Experience using CAD software such as DW-2000 or AutoCAD
Proficient in the use of Microsoft Office Applications
Knowledge, Skills, And Abilities
Knowledge of thin film recording head manufacturing or semiconductor processes, practices, and techniques
Knowledge and ability to use CAD or similar software to create complex masks and layouts for use in thin film recording heads
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Ability to manage and track wafer schedules, projects, and design changes efficiently to ensure just-in-time delivery of materials or wafers
Ability to create various reports, presentations, and written sample analysis
Ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, vendors, and management
Ability to work productively and collaboratively with all levels of employees and management
Ability to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize
The hourly rate for this full-time position is between $92,930.00-$136,661.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.
Working Conditions
The Design Integration Engineer works primarily in an indoor environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 or more pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
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