
Advanced Packaging Architect – 2.5D/3D Design
Broadcom, Irvine, CA, United States
A leading tech company in Irvine, California, seeks a seasoned professional for advanced packaging design. The role requires hands-on experience with GDSII-based physical layout and knowledge of 2.5D/3D packaging technology. Candidates should possess a Bachelor's degree in Engineering with 5+ years of experience, or a Master's degree with 3+ years. Competitive salary ranges from $91,000 to $146,000, along with a discretionary bonus and robust benefits including health plans and a 401(K) match.
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