ElectroMechanical Packaging Engineer IV, Circuit Card Packaging
Lockheed Martin, Englewood, CO, United States
Job Summary
The Fleet Ballistic Missile Avionics team is seeking an experienced
Electronics Packaging Engineer
to work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. This position is onsite at the Lockheed Martin Space facility in Littleton or Englewood, CO, with a flexible 9x80 schedule.
Responsibilities
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving problems.
Establish specifications for contract assemblers and raw‑material vendors.
Interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance.
Prepare designs that meet technical, cost, and schedule requirements and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for fabrication and assembly of the hardware.
Identify initial physical architecture for the avionics subsystem.
Conduct R&D trade studies for Pre‑SRR design phase.
Define requirements and provide framework for architecture and interface development throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end‑of‑year reports.
Work on a cross‑functional team in the development and integration of world‑class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and perform stress and thermal analysis.
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions, and Failure Review Board (FRB) as required.
Resolve test anomalies and support system‑level testing.
Qualifications
Bachelor of Science or higher in Mechanical, Aerospace Engineering, or related discipline, or equivalent experience/combined education.
5+ years of professional experience in circuit card enclosure design.
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks, or similar).
Experience with EPDM tools or equivalent.
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with CREO CAD modeling and Zuken.
Missile/Aerospace related experience.
Proficiency in Microsoft Office Software (Word, Excel, Project, PowerPoint).
Familiarity with FBM specifications/procedures.
Familiarity and experience partnering with SP/SPF Customer Partners.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
Previous CPE and MRB experience.
Ability to communicate issues and additional resource needs to leadership.
Experience with subcontracted hardware suppliers.
Knowledge of cable manufacturing processes (connectors, crimping, soldering, forming, testing).
Experience performing tolerance stack‑ups.
Exposure to Requalification Activities including MORAs and Supplier Relocations.
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
Excellent communication, presentation, and interpersonal skills with technical and non‑technical audiences including design reviews (SRR, PDR, CDR, etc.).
Hands‑on hardware experience.
Clearance & Citizenship
A Top Secret clearance is required (to be obtained and maintained) and U.S. citizenship is required.
Benefits
Medical, Dental, Vision, Life Insurance, Short‑Term and Long‑Term Disability.
401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave.
Paid Time Off and Holidays.
Equal Opportunity Statement
Lockheed Martin is an equal‑opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
#J-18808-Ljbffr
The Fleet Ballistic Missile Avionics team is seeking an experienced
Electronics Packaging Engineer
to work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. This position is onsite at the Lockheed Martin Space facility in Littleton or Englewood, CO, with a flexible 9x80 schedule.
Responsibilities
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving problems.
Establish specifications for contract assemblers and raw‑material vendors.
Interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance.
Prepare designs that meet technical, cost, and schedule requirements and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for fabrication and assembly of the hardware.
Identify initial physical architecture for the avionics subsystem.
Conduct R&D trade studies for Pre‑SRR design phase.
Define requirements and provide framework for architecture and interface development throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end‑of‑year reports.
Work on a cross‑functional team in the development and integration of world‑class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and perform stress and thermal analysis.
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions, and Failure Review Board (FRB) as required.
Resolve test anomalies and support system‑level testing.
Qualifications
Bachelor of Science or higher in Mechanical, Aerospace Engineering, or related discipline, or equivalent experience/combined education.
5+ years of professional experience in circuit card enclosure design.
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks, or similar).
Experience with EPDM tools or equivalent.
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with CREO CAD modeling and Zuken.
Missile/Aerospace related experience.
Proficiency in Microsoft Office Software (Word, Excel, Project, PowerPoint).
Familiarity with FBM specifications/procedures.
Familiarity and experience partnering with SP/SPF Customer Partners.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
Previous CPE and MRB experience.
Ability to communicate issues and additional resource needs to leadership.
Experience with subcontracted hardware suppliers.
Knowledge of cable manufacturing processes (connectors, crimping, soldering, forming, testing).
Experience performing tolerance stack‑ups.
Exposure to Requalification Activities including MORAs and Supplier Relocations.
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
Excellent communication, presentation, and interpersonal skills with technical and non‑technical audiences including design reviews (SRR, PDR, CDR, etc.).
Hands‑on hardware experience.
Clearance & Citizenship
A Top Secret clearance is required (to be obtained and maintained) and U.S. citizenship is required.
Benefits
Medical, Dental, Vision, Life Insurance, Short‑Term and Long‑Term Disability.
401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave.
Paid Time Off and Holidays.
Equal Opportunity Statement
Lockheed Martin is an equal‑opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
#J-18808-Ljbffr