Sr Staff Semiconductor Process Engineer
Lockheed Martin, Goleta, CA, United States
You will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced Focal Plane Arrays (FPAs), and we are looking for a talented engineer to join our team.
What You Will Be Doing
As a Staff FPA Process Engineer, you will be responsible for the technical and production leadership in the fabrication and execution of advanced Focal Plane Array (FPA) technologies, including wicking, plasma system, substrate thinning, dicing, Anti‑Reflection (AR) coating, and flip‑chip bonding for hybridization. You will play a critical role in developing and optimizing the processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and in precisely aligning and bonding detector arrays with readout integrated circuits (ROICs) to create high‑performance FPAs.
Assignments include defining processing and handling equipment requirements and specifications, reviewing processing techniques and methods applied in the manufacturing, fabrication, and evaluation of FPA devices.
Your Responsibilities
Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required, including defining capabilities and leading equipment capital procurement projects.
Lead projects related to process definition, fabrication, modification, and evaluation of FPA devices and components.
Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives; contribute to troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.
Basic Qualifications
Bachelor’s degree from an accredited college in Engineering, Physics, or a related discipline.
Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or Anti‑Reflection coating.
Must be a U.S. Citizen, as this position is located at a facility that requires special access.
Desired Skills
9+ years of industry experience or an advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7+ years of industry experience.
Background in IR FPA packaging, specifically flip‑chip hybridization techniques.
Knowledge of semiconductor device physics, photodetectors, and FPAs.
Proficiency in MS Office (Word, PowerPoint, Excel).
Excellent engineering documentation and communication skills.
Ability to interface from the technician level to senior management with excellent written, verbal, and interpersonal communication, and to collaborate effectively with cross‑functional teams and train technical staff.
Experience leading multifunctional teams.
Ability to multi‑task, organize, and prioritize assignments independently.
Experience with Design of Experiments (DOE), statistical process control (SPC), and data analysis software such as JMP.
Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.
Pay Rate
The annual base salary range for this position in California, Massachusetts, and New York (excluding most major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington, or Washington DC is $134,000 - $236,325. For states not referenced above, the salary will reflect the candidate’s final work location. This figure is a general guideline only.
Benefits Offered
Medical, Dental, Vision
Life Insurance, Short‑Term Disability, Long‑Term Disability
401(k) match, Flexible Spending Accounts
EAP, Education Assistance, Parental Leave
Paid Time Off and Holidays
This position is incentive plan eligible.
Equal Opportunity Employer
Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
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What You Will Be Doing
As a Staff FPA Process Engineer, you will be responsible for the technical and production leadership in the fabrication and execution of advanced Focal Plane Array (FPA) technologies, including wicking, plasma system, substrate thinning, dicing, Anti‑Reflection (AR) coating, and flip‑chip bonding for hybridization. You will play a critical role in developing and optimizing the processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and in precisely aligning and bonding detector arrays with readout integrated circuits (ROICs) to create high‑performance FPAs.
Assignments include defining processing and handling equipment requirements and specifications, reviewing processing techniques and methods applied in the manufacturing, fabrication, and evaluation of FPA devices.
Your Responsibilities
Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required, including defining capabilities and leading equipment capital procurement projects.
Lead projects related to process definition, fabrication, modification, and evaluation of FPA devices and components.
Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives; contribute to troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.
Basic Qualifications
Bachelor’s degree from an accredited college in Engineering, Physics, or a related discipline.
Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or Anti‑Reflection coating.
Must be a U.S. Citizen, as this position is located at a facility that requires special access.
Desired Skills
9+ years of industry experience or an advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7+ years of industry experience.
Background in IR FPA packaging, specifically flip‑chip hybridization techniques.
Knowledge of semiconductor device physics, photodetectors, and FPAs.
Proficiency in MS Office (Word, PowerPoint, Excel).
Excellent engineering documentation and communication skills.
Ability to interface from the technician level to senior management with excellent written, verbal, and interpersonal communication, and to collaborate effectively with cross‑functional teams and train technical staff.
Experience leading multifunctional teams.
Ability to multi‑task, organize, and prioritize assignments independently.
Experience with Design of Experiments (DOE), statistical process control (SPC), and data analysis software such as JMP.
Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.
Pay Rate
The annual base salary range for this position in California, Massachusetts, and New York (excluding most major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington, or Washington DC is $134,000 - $236,325. For states not referenced above, the salary will reflect the candidate’s final work location. This figure is a general guideline only.
Benefits Offered
Medical, Dental, Vision
Life Insurance, Short‑Term Disability, Long‑Term Disability
401(k) match, Flexible Spending Accounts
EAP, Education Assistance, Parental Leave
Paid Time Off and Holidays
This position is incentive plan eligible.
Equal Opportunity Employer
Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
#J-18808-Ljbffr