Senior Thermal Engineer (Teradyne, North Reading, MA)
Teradyne, North Reading, MA, United States
Senior Thermal Engineer (Teradyne, North Reading, MA)
Date:
Apr 27, 2026
Location:
North Reading, MA, US
We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!
We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.
Our Purpose
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought in our workforce. Our employees are supported to innovate and learn something new every day. We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team—one that makes better decisions, drives innovation, and delivers better business results.
Opportunity Overview
We are seeking a Senior / Principal Mechanical Engineer to provide technical leadership within the System Level Test (SLT) Thermal Engineering group. This role focuses on the design and delivery of advanced thermal solutions that enable testing of high‑power semiconductor devices under challenging operating conditions.
The SLT Thermal group develops end‑to‑end thermal systems, including device‑level cooling hardware, liquid cooling architectures, and active thermal control methods. These solutions support testing of CPUs, GPUs, AI accelerators, automotive ICs, and advanced multi‑die packages at very high-power levels and power densities, where traditional thermal approaches are not sufficient.
This position is suited for an engineer who combines strong fundamentals, hands‑on experimental work, and system‑level thinking, and who is comfortable owning technical direction from concept through production. You will be expected to be the subject‑matter expert and thermal management architect of entire system platforms.
What You’ll Work On
In this role, you will lead the definition, design, and validation of thermal systems that directly enable system‑level semiconductor test. The work spans device interfaces through full system integration and requires close collaboration with mechanical, electrical, controls, software, and systems engineering teams.
Technical Field
Architecting and developing device‑level thermal solutions, including liquid‑cooled cold plates, advanced thermal interface materials, and mechanically compliant interfaces designed for repeated test contact and high reliability
Designing and analyzing liquid cooling systems that support very high-power density devices, including multi‑branch and manifolded coolant distribution architectures
Leading thermal simulation efforts using CFD and analytical methods to assess steady‑state and transient thermal behavior under non‑uniform heat flux and fast power changes
Developing thermal solutions that support elevated‑temperature operation and rapid thermal transients, where tight junction‑temperature control is critical for test accuracy and device safety
Defining and executing experimental validation plans, including lab instrumentation, data acquisition, and detailed correlation of experimental results to simulation models
Collaborating with controls and software engineers to support active thermal control concepts
Supporting the transition of thermal designs from prototype through qualification and high‑volume manufacturing, including supplier engagement and technical issue resolution
Mentoring junior engineers, reviewing technical work, and contributing to thermal design best practices and standards within the organization
Management and Research Field
Working directly with semiconductor manufacturers and system companies to understand device‑level thermal requirements, test conditions, power profiles, packaging constraints, and roadmap needs
Translating customer requirements into clear, actionable product and architecture definitions, balancing performance, risk, cost, and schedule
Engaging with customers through onsite visits, technical reviews, and joint debug sessions
Acting as a technical point of contact and subject‑matter expert for thermal topics during customer engagements, design reviews, and escalation scenarios
Managing customer expectations, timelines, and feature requests, including clear communication of tradeoffs, risks, and development maturity
Supporting definition and execution of customer‑driven development programs, from early feasibility through deployment into production environments
The role is also expected to maintain strong technical currency and external awareness, including:
Staying current with scientific and industrial advancements in semiconductor thermal management, advanced packaging, liquid cooling, materials, and thermal control methods
Monitoring emerging technologies and approaches across academia, suppliers, and adjacent industries
Evaluating new concepts and determining when and how they can be transitioned from research or prototype into robust, manufacturable product solutions
Comfortably productizing emerging or immature technologies under aggressive schedules, making disciplined engineering decisions to balance innovation with reliability and delivery commitments
Focused Responsibilities
Technical Leadership
Own and drive thermal architecture for complex SLT subsystems and systems
Lead design trade studies considering performance, reliability, manufacturability, and cost
Serve as a technical resource and mentor for other engineers in the group
Thermal Design & Analysis
Perform and guide thermal modeling using CFD and analytical methods
Design and optimize liquid‑cooled cold plates, thermal interfaces, and supporting structures
Evaluate thermal performance of advanced device packages with non‑uniform and transient heat loads
Plan and execute thermal experiments to validate designs
Use experimental data to refine models and inform design decisions
Productization & Manufacturing Support
Support transition from prototype to manufacturing
Work with suppliers and manufacturing partners on advanced thermal hardware
Investigate and resolve thermal issues encountered during qualification or production
Required Qualifications
Education & Experience
B.S. in Mechanical Engineering (M.S. or Ph.D. a plus)
Typically, 8+ years of experience in thermal, heat‑transfer, or mechanical systems engineering
Ability to demonstrate academic knowledge of heat transfer principles
Technical Skills
Strong foundation in heat transfer, fluid mechanics, and thermal system design
Experience with liquid cooling systems and high‑power electronics
Proficiency with thermal simulation tools (CFD / FEA)
Experience working with lab data, test instrumentation, and model correlation
Tools & Methods
CAD experience (SolidWorks or equivalent)
Thermal simulation tools such as ANSYS Fluent, Icepak, COMSOL, OpenFOAM or similar
Data analysis using tools such as MATLAB SIMULINK, Python, or LabVIEW
Please note: We are only considering candidates local to the position location and are unable to provide relocation for this position. This position is not eligible for visa sponsorship.
Compensation:
The base salary range for this role is $121,700 - $194,700. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.
Incentive Plan:
This job is eligible for discretionary bonus(es) based on financial performance.
Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. Please click here to see details.
Job Segment:
Thermal Engineering, Testing, Mechanical Engineer, Electronics Engineer, Manufacturing Engineer, Engineering, Technology
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Date:
Apr 27, 2026
Location:
North Reading, MA, US
We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!
We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.
Our Purpose
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought in our workforce. Our employees are supported to innovate and learn something new every day. We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team—one that makes better decisions, drives innovation, and delivers better business results.
Opportunity Overview
We are seeking a Senior / Principal Mechanical Engineer to provide technical leadership within the System Level Test (SLT) Thermal Engineering group. This role focuses on the design and delivery of advanced thermal solutions that enable testing of high‑power semiconductor devices under challenging operating conditions.
The SLT Thermal group develops end‑to‑end thermal systems, including device‑level cooling hardware, liquid cooling architectures, and active thermal control methods. These solutions support testing of CPUs, GPUs, AI accelerators, automotive ICs, and advanced multi‑die packages at very high-power levels and power densities, where traditional thermal approaches are not sufficient.
This position is suited for an engineer who combines strong fundamentals, hands‑on experimental work, and system‑level thinking, and who is comfortable owning technical direction from concept through production. You will be expected to be the subject‑matter expert and thermal management architect of entire system platforms.
What You’ll Work On
In this role, you will lead the definition, design, and validation of thermal systems that directly enable system‑level semiconductor test. The work spans device interfaces through full system integration and requires close collaboration with mechanical, electrical, controls, software, and systems engineering teams.
Technical Field
Architecting and developing device‑level thermal solutions, including liquid‑cooled cold plates, advanced thermal interface materials, and mechanically compliant interfaces designed for repeated test contact and high reliability
Designing and analyzing liquid cooling systems that support very high-power density devices, including multi‑branch and manifolded coolant distribution architectures
Leading thermal simulation efforts using CFD and analytical methods to assess steady‑state and transient thermal behavior under non‑uniform heat flux and fast power changes
Developing thermal solutions that support elevated‑temperature operation and rapid thermal transients, where tight junction‑temperature control is critical for test accuracy and device safety
Defining and executing experimental validation plans, including lab instrumentation, data acquisition, and detailed correlation of experimental results to simulation models
Collaborating with controls and software engineers to support active thermal control concepts
Supporting the transition of thermal designs from prototype through qualification and high‑volume manufacturing, including supplier engagement and technical issue resolution
Mentoring junior engineers, reviewing technical work, and contributing to thermal design best practices and standards within the organization
Management and Research Field
Working directly with semiconductor manufacturers and system companies to understand device‑level thermal requirements, test conditions, power profiles, packaging constraints, and roadmap needs
Translating customer requirements into clear, actionable product and architecture definitions, balancing performance, risk, cost, and schedule
Engaging with customers through onsite visits, technical reviews, and joint debug sessions
Acting as a technical point of contact and subject‑matter expert for thermal topics during customer engagements, design reviews, and escalation scenarios
Managing customer expectations, timelines, and feature requests, including clear communication of tradeoffs, risks, and development maturity
Supporting definition and execution of customer‑driven development programs, from early feasibility through deployment into production environments
The role is also expected to maintain strong technical currency and external awareness, including:
Staying current with scientific and industrial advancements in semiconductor thermal management, advanced packaging, liquid cooling, materials, and thermal control methods
Monitoring emerging technologies and approaches across academia, suppliers, and adjacent industries
Evaluating new concepts and determining when and how they can be transitioned from research or prototype into robust, manufacturable product solutions
Comfortably productizing emerging or immature technologies under aggressive schedules, making disciplined engineering decisions to balance innovation with reliability and delivery commitments
Focused Responsibilities
Technical Leadership
Own and drive thermal architecture for complex SLT subsystems and systems
Lead design trade studies considering performance, reliability, manufacturability, and cost
Serve as a technical resource and mentor for other engineers in the group
Thermal Design & Analysis
Perform and guide thermal modeling using CFD and analytical methods
Design and optimize liquid‑cooled cold plates, thermal interfaces, and supporting structures
Evaluate thermal performance of advanced device packages with non‑uniform and transient heat loads
Plan and execute thermal experiments to validate designs
Use experimental data to refine models and inform design decisions
Productization & Manufacturing Support
Support transition from prototype to manufacturing
Work with suppliers and manufacturing partners on advanced thermal hardware
Investigate and resolve thermal issues encountered during qualification or production
Required Qualifications
Education & Experience
B.S. in Mechanical Engineering (M.S. or Ph.D. a plus)
Typically, 8+ years of experience in thermal, heat‑transfer, or mechanical systems engineering
Ability to demonstrate academic knowledge of heat transfer principles
Technical Skills
Strong foundation in heat transfer, fluid mechanics, and thermal system design
Experience with liquid cooling systems and high‑power electronics
Proficiency with thermal simulation tools (CFD / FEA)
Experience working with lab data, test instrumentation, and model correlation
Tools & Methods
CAD experience (SolidWorks or equivalent)
Thermal simulation tools such as ANSYS Fluent, Icepak, COMSOL, OpenFOAM or similar
Data analysis using tools such as MATLAB SIMULINK, Python, or LabVIEW
Please note: We are only considering candidates local to the position location and are unable to provide relocation for this position. This position is not eligible for visa sponsorship.
Compensation:
The base salary range for this role is $121,700 - $194,700. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.
Incentive Plan:
This job is eligible for discretionary bonus(es) based on financial performance.
Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. Please click here to see details.
Job Segment:
Thermal Engineering, Testing, Mechanical Engineer, Electronics Engineer, Manufacturing Engineer, Engineering, Technology
#J-18808-Ljbffr